JPH0195735U - - Google Patents
Info
- Publication number
- JPH0195735U JPH0195735U JP19235287U JP19235287U JPH0195735U JP H0195735 U JPH0195735 U JP H0195735U JP 19235287 U JP19235287 U JP 19235287U JP 19235287 U JP19235287 U JP 19235287U JP H0195735 U JPH0195735 U JP H0195735U
- Authority
- JP
- Japan
- Prior art keywords
- blocks
- dovetail groove
- seal
- ring
- chase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19235287U JPH0195735U (en]) | 1987-12-17 | 1987-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19235287U JPH0195735U (en]) | 1987-12-17 | 1987-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195735U true JPH0195735U (en]) | 1989-06-26 |
Family
ID=31483214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19235287U Pending JPH0195735U (en]) | 1987-12-17 | 1987-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195735U (en]) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843900A (ja) * | 1981-09-08 | 1983-03-14 | 三菱電機株式会社 | 三軸衛星の軌道制御方式 |
| JPS5967031A (ja) * | 1982-10-08 | 1984-04-16 | Hitachi Ltd | 成形機 |
| JPS6063122A (ja) * | 1983-09-16 | 1985-04-11 | Michio Osada | 半導体素子の樹脂封入成形方法及びその金型装置 |
-
1987
- 1987-12-17 JP JP19235287U patent/JPH0195735U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843900A (ja) * | 1981-09-08 | 1983-03-14 | 三菱電機株式会社 | 三軸衛星の軌道制御方式 |
| JPS5967031A (ja) * | 1982-10-08 | 1984-04-16 | Hitachi Ltd | 成形機 |
| JPS6063122A (ja) * | 1983-09-16 | 1985-04-11 | Michio Osada | 半導体素子の樹脂封入成形方法及びその金型装置 |